Production

production line

We always puts quality management first, winning the market with high-quality products and excellent services.

Manufacturing Process

The manufacturing process integrates solidification, wire welding, injection molding, molding, testing, and packaging.

Manufacturing Process

Packaging

We excels in various aspects of IC research and development, design, chip fabrication, packaging, testing, sales, and service.

DIP-14
DIP-14
SOP-14
SOP-14
TSSOP-14
TSSOP-14
DIP-16
DIP-16
SOP-16
SOP-16
DIP-18
DIP-18
DIP-20
DIP-20
SOP-20
SOP-20
DIP-8
DIP-8
SOP-8
SOP-8
MSOP-8
MSOP-8
SOP16W
SOP16W
SSOP-20
SSOP-20
SOT223
SOT223
SOT89
SOT89
SOT252
SOT252
SOT23
SOT23
SC70-5
SC70-5
SOT-23-5
SOT-23-5
SC70-5L
SC70-5L
SOT23-6
SOT23-6
SSOP24
SSOP24
DFN24
DFN24
SOIC24
SOIC24
TO-220-5
TO-220-5
TO-263-5
TO-263-5
TO-220B
TO-220B
TO-252
TO-252
TO-220
TO-220
TO252-2L
TO252-2L
TO-92
TO-92
ZIP-15
ZIP-15

We have been looking forward to your attention!

HotLine

0755-82812045

E-mail:xblw@xinboleic.com

Address:Shangmeilin Excellence City, Futian District, Shenzhen

Shenzhen Product R&D/Packaging Testing: 2nd Floor, Building 3, Antongda Industrial Park, Liuxian 1st Road, Xin'an Street, Bao'an District

Shenzhen Xinbole Electronics Co., Ltd

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