Production

production line

We always puts quality management first, winning the market with high-quality products and excellent services.

Manufacturing Process

The manufacturing process integrates solidification, wire welding, injection molding, molding, testing, and packaging.

Manufacturing Process

Packaging

We excels in various aspects of IC research and development, design, chip fabrication, packaging, testing, sales, and service.

DIP-14
DIP-14
SOP-14
SOP-14
TSSOP-14
TSSOP-14
DIP-16
DIP-16
SOP-16
SOP-16
DIP-18
DIP-18
DIP-20
DIP-20
SOP-20
SOP-20
DIP-8
DIP-8
SOP-8
SOP-8
MSOP-8
MSOP-8
SOP16W
SOP16W
SSOP-20
SSOP-20
SOT223
SOT223
SOT89
SOT89
SOT252
SOT252
SOT23
SOT23
SC70-5
SC70-5
SOT-23-5
SOT-23-5
SC70-5L
SC70-5L
SOT23-6
SOT23-6
SSOP24
SSOP24
DFN24
DFN24
SOIC24
SOIC24
TO-220-5
TO-220-5
TO-263-5
TO-263-5
TO-220B
TO-220B
TO-252
TO-252
TO-220
TO-220
TO252-2L
TO252-2L
TO-92
TO-92
ZIP-15
ZIP-15

We have been looking forward to your attention!

HotLine

+86 181 3822 1713

E-mail:tdbdt@sztdbdt.Com

Address:Building 3, Zone 30, No. 2 Kefa Road, Science and Technology Park Community, Yuehai Subdistrict, Nanshan District, Shenzhen

Shenzhen Tudi Semiconductor Co., Ltd.

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